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Low power dissipation
This is an ON Semiconductor NCL30100ASLDGEVB Dimmable LED Demonstration Board Evaluation Board LED Driver Demonstration Board
Quick start guide
Intel Chipset: SLJ8E (Intel HM76 Express Chipset)
Samsung MN18R1628EF0-CT9 BGA NexMod 256MB ECC Module category_Business & Industrial;Electrical Equipment & Supplies;Fuses Low power dissipationThis item is a Samsung 288mb BGA connector memory module with 8 chips part number: K4R881869E GCT9 Specifications: Module Configuration: NexMod Module (BGA type connector) Data Bits & Module Type: X18 ECC Feature: Direct RAMBUSTM DRAM Depth: 16M Refresh, # of Banks in Comp.& Interface(VDD, VDDQ): 16K 32ms Ref. Dependent 2* 16 Banks Number of Component: 8ea Component Revision: 6th Generation Package Type: WBGA PCB Revision & Type: Mother Version Power:
