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DiaSec Diamond Wafering Blade - General Purpose Metallography 6in 25 lbs The premium silicon carbide abrasive

SKU: 8846125726

4.1
EUR175.00 EUR216.00

Pay in 4 interest-free payments of $43.75 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 5 - Aug 10

Description

The premium silicon carbide abrasive produces aggressive

Item No: ALP-653

Particle Size: 3 Micron

Quantity: 1/pkg

DiaSec Diamond Wafering Blade - General Purpose Metallography 6in 25 lbs The premium silicon carbide abrasiveThe DiaSec General Purpose Diamond Blade is a must have for metallurgical sample preparation. Made with metal bonding, this 6in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert. Diameter: 6in (150mm) Thickness: 0. 024in (0. 6mm) Arbor: 0. 5in (12. 7mm) Item No DS 1006 1 pkg

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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